3D IC stacking technology
著者
書誌事項
3D IC stacking technology
McGraw-Hill, c2011
- : hardback
- タイトル別名
-
Three D IC stacking technology
大学図書館所蔵 全1件
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注記
Includes bibliographical references and index
"Electrical engineering"--Back cover
内容説明・目次
内容説明
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.
3D IC Stacking Technology covers:
High density through silicon stacking (TSS) technology
Practical design ecosystem for heterogeneous 3D IC products
Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
Process integration for TSV manufacturing
High-aspect-ratio silicon etch for TSV
Dielectric deposition for TSV
Barrier and seed deposition
Copper electrodeposition for TSV
Chemical mechanical polishing for TSV applications
Temporary and permanent bonding
Assembly and test aspects of TSV technology
目次
Chapter 1. Introduction to High-Density Through Silicon Stacking Technology
Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products
Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack
Chapter 4. Process Integration for TSV Manufacturing
Chapter 5. High-Aspect-Ratio Silicon Etch for TSV
Chapter 6. Dielectric Deposition for Through Silicon Vias
Chapter 7. Barrier and Seed Deposition
Chapter 8. Copper Electrodeposition for TSV
Chapter 9. Chemical Mechanical Polishing for TSV
Chapter 10. Temporary and Permanent Bonding
Chapter 11. Assembly and Test Aspects of TSV Technology
Index
「Nielsen BookData」 より