3D IC stacking technology

著者

書誌事項

3D IC stacking technology

Banqiu Wu, Ajay Kumar, Sesh Ramaswami

McGraw-Hill, c2011

  • : hardback

タイトル別名

Three D IC stacking technology

大学図書館所蔵 件 / 全1件

この図書・雑誌をさがす

注記

Includes bibliographical references and index

"Electrical engineering"--Back cover

内容説明・目次

内容説明

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology

目次

Chapter 1. Introduction to High-Density Through Silicon Stacking Technology Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack Chapter 4. Process Integration for TSV Manufacturing Chapter 5. High-Aspect-Ratio Silicon Etch for TSV Chapter 6. Dielectric Deposition for Through Silicon Vias Chapter 7. Barrier and Seed Deposition Chapter 8. Copper Electrodeposition for TSV Chapter 9. Chemical Mechanical Polishing for TSV Chapter 10. Temporary and Permanent Bonding Chapter 11. Assembly and Test Aspects of TSV Technology Index

「Nielsen BookData」 より

詳細情報

ページトップへ