MobiCom '14 : proceedings of the 20th International Conference on Mobile Computing and Networking September 7-11, 2014, Maui, HI, USA

著者

• International Conference on Mobile Computing and Networking
• Association for Computing Machinery
• ACM SIGMOBILE

書誌事項

MobiCom '14 : proceedings of the 20th International Conference on Mobile Computing and Networking September 7-11, 2014, Maui, HI, USA

sponsored by ACM SIGMOBILE

Association for Computing Machinery, [2014]

機械可読データファイル

注記

Supported by : NSF, Cisco, Meraki, Microsoft, Facebook, Google, IBM Research, Inria, Qualcomm Research, Hewlett Packard, and NEC Laboratories America

詳細情報

• NII書誌ID(NCID): BB17919253
• ISBN:
  • 9781450318167
• 出版国コード: xx
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: [S.l.]
• ページ数/冊数: 1 computer disk
• 大きさ: 4 3/4 in