Cooling of microelectronic and nanoelectronic equipment : advances and emerging research

Author(s)

• Iyengar, Madhusudan
• Geisler, Karl J. L.
• Sammakia, Bahgat
• Bar-Cohen, Avram

Bibliographic Information

Cooling of microelectronic and nanoelectronic equipment : advances and emerging research

editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia ; editor-in-chief, Avram Bar-Cohen

（Encyclopedia of thermal packaging, set 2 . Thermal packaging tools ; v. 1）

World Scientific, c2015

Note

XISBN for subseries "Thermal packaging tools": 9789814327602

Includes bibliographical references and indexes

Details

• NCID: BB17964837
• ISBN:
  • 9789814327633
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Hackensack, N.J.
• Pages/Volumes: xix, 406 p.
• Size: 26 cm
• Classification:
  • DC23 : 621.381046
• Subject Headings:
  • LCSH : Microelectronic packaging
  • LCSH : Insulation (Heat)
  • LCSH : Electronic apparatus and appliances -- Cooling
• Parent Bibliography ID:
  • BB17392030