Thermally-informed design of microelectronic components

著者

• Srivastava, Ankur
• Bar-Cohen, Avram

書誌事項

Thermally-informed design of microelectronic components

Ankur Srivastava ... [et al.] ; editor-in-chief, Avram Bar-Cohen

（Encyclopedia of thermal packaging, set 2 . Thermal packaging tools ; v. 4）

World Scientific, c2015

注記

XISBN for subseries "Thermal packaging tools": 9789814327602

Includes bibliographical references and indexes

詳細情報

• NII書誌ID(NCID): BB17966275
• ISBN:
  • 9789814583435
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Hackensack, N.J.
• ページ数/冊数: xiv, 192 p.
• 大きさ: 26 cm
• 分類:
  • DC23 : 621.381046
• 件名:
  • LCSH : Microelectronic packaging
  • LCSH : Insulation (Heat)
  • LCSH : Electronic apparatus and appliances -- Cooling
• 親書誌ID:
  • BB17392030