11th International Congress Molded Interconnect Devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg/Fuerth, Germany

著者

    • International Congress Molded Interconnect Devices
    • Franke, Jörg
    • Kuhn, Thomas
    • Birkicht, Albert
    • Pojtinger, Andreas

書誌事項

11th International Congress Molded Interconnect Devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg/Fuerth, Germany

edited by Jörg Franke ... [et al.]

(Advanced materials research, v. 1038)

Trans Tech Publications, c2014

  • : pbk

タイトル別名

11th International Congress Molded Interconnect Devices : scientific proceedings : 3-D MID

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注記

Includes bibliographical references and indexes

Other editors: Thomas Kuhn, Albert Birkicht and Andreas Pojtinger

内容説明・目次

内容説明

Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability.

目次

Preface and Committees Chapter 1: Development and Prototyping Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools Optimized Process Sequences for Prototyping of Molded Interconnect Devices Integration of Functional Circuits into FDM Parts Chapter 2: Printing Technologies Printing of Functional Structures on Molded 3D Devices Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing Chapter 3: Materials and Manufacturing Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray Method Experimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography MID Fabricated by Ultrasonic Processing Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation Chapter 4: Manufacturing Processes Study of MID Technologies for Automotive Lighting and Light Signaling Devices Chapter 5: Assembly Technologies and Inspection Design and Solder Process Optimization in MID Technology for High Power Applications Chapter 6: Quality and Reliability Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID

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詳細情報

  • NII書誌ID(NCID)
    BB18508935
  • ISBN
    • 9783038352525
  • 出版国コード
    sz
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Pfaffikon
  • ページ数/冊数
    x, 124 p.
  • 大きさ
    24 cm
  • 親書誌ID
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