Advanced Metallization Conference 2002 (AMC 2002) : proceedings of the conference held October 1-3, 2002, in San Diego, California, U.S.A., and October 29-30, 2002, University of Tokyo, Tokyo, Japan. This Conference is MRS affiliated and sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A.
著者
書誌事項
Advanced Metallization Conference 2002 (AMC 2002) : proceedings of the conference held October 1-3, 2002, in San Diego, California, U.S.A., and October 29-30, 2002, University of Tokyo, Tokyo, Japan. This Conference is MRS affiliated and sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A.
（Materials Research Society conference proceedings）
Materials Research Society, c2003
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注記
Includes bibliographical references and indexes
Other editors: Timothy S. Cale, Shigeaki Zaima, Tomohiro Ohta
内容説明・目次
内容説明
Leading-edge metallization schemes inherently involve the introduction of novel metal systems and novel dielectric materials. Technological advances highlighted during AMC 2002 include the latest developments in integrating copper-based metallization with low-dielectric constant materials and in evaluating the reliability of such interconnects. For the second consecutive year, the volume takes a special look at the status of vertical integration, or 3D chips, and the promise it holds for high-density functional integration and heterogeneous integration. Technical leaders from around the world come together in this volume, the 18th in a popular series from the Materials Research Society, to offers a comprehensive overview of the current state of advanced metallization science and technologies. Topics include: advanced interconnects, 3D integration and packaging; CMP; reliability, test and characterization; metallization; integration; low-k/dielectric materials and characterization; atomic layer deposition (ALD) and barriers.
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