Advances in abrasive technology XVIII : selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea
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Bibliographic Information
Advances in abrasive technology XVIII : selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea
（Advanced materials research, v. 1136）
Trans Tech Publications, c2016
- : pbk
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Note
Includes bibliographical references and indexes
Other editors: Haedo Jeong, Xiping Xu and Hideki Aoyama
Description and Table of Contents
Description
Collection of selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea.
The 114 papers are grouped as follows:
Chapter 1: Grinding
Chapter 2: Abrasive Jet Machining
Chapter 3: Advanced Cutting Technology
Chapter 4: Processing of Brittle Materials
Chapter 5: Chemical Mechanical Polishing, Processing of Semiconductor Wafer
Chapter 6: Electrical Discharge Machining, Ultrasonic and Beam Machining
Chapter 7: Finishing, Lapping and Polishing
Chapter 8: Surface and Subsurface Integrity and Materials Characterization
Chapter 9: In-Process Measurement and Monitoring, Metrology
Chapter 10: Machine Tools and Systems, Tooling Processing
Table of Contents
Preface, Committees and Sponsors
Chapter 1: Grinding
Deep Profiled Slot Grinding on a Nickel-Based Alloy with Electroplated CBN Wheels
Experimental Study on the Surface Roughness in Mesoscopic-Scale Grinding of Nickel-Based Superalloy
Grinding Behavior of Yttrium Partially Stabilized Zirconia Using Diamond Grinding Wheel
Experiment and Finite Element Analysis Research on Surface Roughness in Micro-Grinding H62
Research on Grinding Force of Zirconia Internal Grinding with Resin Bond Diamond Wheel
Dental Grinding of Lithium Disilicate Ceramic Prostheses Using High-Speed Rotary Cutting Instruments in In Vitro Oral Adjusting
Experiment and Surface Roughness Prediction Model for Ti-6Al-4V in Abrasive Belt Grinding
Grinding for Microstructural Functional Surface
Grinding Technology of Cylindrical Surface with Protrusion
Experimental Study on Profile Machining of Titanium Alloys with Superabrasive Tools
Characteristics in Grinding of YVO4 with a Resin Bond Diamond Wheel
Optimizing the Grinding Process through Reduction of the Loading of Grinding Tool by Infiltration
Forces during Grinding Operation and its Relation to the Dressing Cycle
Experimental Study of Fabrication of Cast-Iron Bonded cBN Grinding Wheels by V-EPC (I) - The Influence Factors on the Qualities of Grinding Layer
Optimization and Application of Laser-Dressed cBN Grinding Wheels
Experimental Investigation on Bronze-Bonded CBN Formed Grinding Wheel by Means of Electro-Discharging Dressing
Recyclability and Performance Stability of Corrosion Inhibition Improved Amine-Free Water-Soluble Cutting Coolant
Chapter 2: Abrasive Jet Machining
An Investigation of Hole Machining Process on a Carbon-Fiber Reinforced Plastic Sheet by Abrasive Waterjet
Investigation of Decision Criteria for Abrasive Conditions in Multi-Small-Hole Drilling of CFRP by Blast Process
Control of Machining Profiles Based on Material Removal Capabilities in Cylindrical Blasting
Study on Effect of Viscoelastic Properties on Surface Roughness Uniformity in Abrasive Flow Machining for Plate Surface
Chapter 3: Advanced Cutting Technology
Influence of Fiber Orientation on Machined Surface Quality in Milling of Unidirectional CFRP Laminates
Influence of Pulsed Magnetic Treatment on Wear of Carbide Micro-end-Mill
Milling Force and Machining Deformation in Mirror Milling of Aircraft Skin
Molecular Dynamics Simulation of a Cutting Method by Making Use of Localized Hydrostatic Pressure
Machining Accuracy and Cutting Temperature Property in Deep Hole Drilling of Stainless Steel
Tool Wear Characteristics of Cylindrical Cutting of Nickel-Based Super Alloy
Influence of Endmill Tool Run-Out to Machining Accuracy in Micro-Groove Milling
Influence of Tool Shape on Cutting Characteristics in Ultra-Precision Cutting of Al-Mg Alloys
Study on Machining Single-Crystal Nickel by Molecular Dynamics Simulation
Proposal of Tilt Helical Milling Method for Hole Creation of Carbon Fiber Reinforced Plastic (CFRP)
Experimental Study on Surface Quality in Micro-Milling of Single Crystal Superalloy
End-Milling of CFRP/Ti-6Al-4V with Electroplated cBN Tool
Proposal of Constant Load Feeding Method as a High Precision Cutting Tool for CFRP
Temperature Field Study of Hole Drilling in Kevlar Composites
Influencing Factors of Surface Generation in Ultra-Precision Fly Cutting
Development of a New Burnishing Method Utilizing a Flank Face of a Turning Tool and its Burnishing Performance
Experimental Study on Thermal and Force Characteristics in the Dry Slotting of Cortical Bone
Effect of Diamond Coating on Drilling Force and Temperature during High Speed Micro Drilling of Bone
Face Turning of Cobalt-Free Tungsten Carbide Using Nano-Polycrystalline Diamond Tool
Study on High Speed Milling of Steam Turbine Blade Materials
Synthesis and Characterization of AlMgB14-Ni3Al Composites for Cutting Tool Materials
Chapter 4: Processing of Brittle Materials
Chip Formation during Precision Cutting of Metallic Glass
Characterization of KDP Crystal Surfaces from Single Point Diamond Milling
Experimental Investigation at Relatively High Speed Scratching Induced by a Developed Diamond Tip
Study on the Ductile Removal Behavior of K9 Glass with Nano-Scratch
FEM Stress Analysis of Interfacial Failure of Multilayered Thin Film Structures in Nanoscratching
Experimental Study on Effects of Translational Movement on Surface Planarity in Magnetorheological Planarization Process
Chapter 5: Chemical Mechanical Polishing, Processing of Semiconductor Wafer
Fundamental Micro-Grooving Characteristics of Hard and Brittle Materials with a Fine Wire Tool
Effect of Citric Acid in Chemical Mechanical Polishing (CMP) for Lithium Tantalate (LiTaO3) Wafer
Study on Sapphire Wafer Grinding by Chromium Oxide (Cr2O3) Wheel
Study on Removal Mechanism of Sapphire in Plasma Assisted Polishing
Polishing of Aluminum Alloy Using Photocatalyst and Cathilon Dye under Utraviolet Irradiation
Study on the Influence of pH on MRR Based on Acidic Slurry in CMP of 304 Stainless Steel
Study on the Slicing of Sapphire Using a Wire Tool
Numerical Analysis of Slurry Flow and Contact Pressure in CMP Considering the Effects of Retaining Ring
Theoretical Research on Contact Length in the Rocking Motion Wire Saw
Study on Precision Slicing Process of Single-Crystal Silicon by Using Dicing Wire Saw
Chapter 6: Electrical Discharge Machining, Ultrasonic and Beam Machining
Experimental Study on Ultrasonic Vibration-Assisted Grinding of High Volume Fraction SiCp/Al Composites Micro-Hole
Fundamental Investigation of Ultrasonic Assisted Surface Grinding of Inconel 718
Machining Technology of Ultrasonic Assisted Grinding for a Silicon Carbide Wafer Carrier
The Effect of Fiber Laser Machining Parameters on Thermal-Affected Zone of Carbon Fiber Reinforced Plastic
Development of EDT Equipment Using Wire Tool Electrode
Effect of Cutting Speed on Ultrasonically Added Turning in Soft Magnetic Stainless Steel
Study on the Specific Energy Characteristics of the Ultrasonic Vibration Assisted Sawing Ceramic
A Study on Ultrasonic Torsional Vibration-Assisted Abrasive Waterjet Polishing of Ceramic Materials
Analysis and Optimization of Surface Roughness in Rotary Ultrasonic Burnishing of Titanium Alloy Ti-6Al-4V
Electrical Discharge Dressing (EDD) of Metal Bonded Diamond Arc Grinding Wheels
High Efficiency EDM of PCD Utilizing a Specific Transition Metal Electrode
Hybrid Process of Laser Heat Treatment and Forming of Thin Plate with a Small Power Semiconductor Laser
Controllability Study of Single-Crystal Diamond Cutting Tool Focus Ion Beam Milling with Different Beam Current and Tilting Angle
Drilling of Microholes Using Diamond Grinding Tools
Controlled Fabrication of Micro/Nano-Structures on Germanium Using Ultrashort Laser Pulses under Ambient Conditions
Precise Machining Method by Combining EDM and Grinding with a Rotary PCD Segment Tool for Cemented Carbide
Chapter 7: Finishing, Lapping and Polishing
Nano-Precision Polishing of Oxygen-Free Copper Using MCF (Magnetic Compound Fluid) Slurry
Influence of Components on the Rheological Property of Shear Thickening Polishing Slurry
Development of Polishing Tool Capable of Self-Adaptive to Processing Site Using Steel Balls and Magnetic Force
Investigation of Abrasive Super Finishing under Various Paths with a 5-Axis Closed-Link Compact Robot and Fine Diamond Stone
Surface Roughness and Topography of Honed Nickel-Based Superalloy
Experimental Research on Flexible Polishing by Compound Diamond Powder
Ultraprecision Machining of Si3N4 Ceramics with Shear-Thickening Polishing
Chapter 8: Surface and Subsurface Integrity and Materials Characterization
Surface and Subsurface Integrity of Glass-Ceramics Induced by Ultra-Precision Grinding
Wet-Etching Evaluation Method of Subsurface Damage after Grinding of Glass
A Study on Residual Stresses in Machined Brittle Material
Study on the Inherent Correlations of the Material Properties for Silicon Nitride Ceramic Balls
High-Speed Capturing of Stress Distribution of Workpiece under Ultrasonically Assisted Cutting Condition
Surface Integrity of AlSiC Composites Ground by Monolayer Brazed Diamond Wheels
Coupled Thermal-Mechanical Analysis of CO2 Laser Irradiation on Fused Silica
Surface Integrity of the Compressor Blade when Employing Different Polishing Method
The Dynamic Mechanical Properties of Oxygen Free Copper under the Impact Load
Study on Mechanical Properties of Single-Crystal Silicon Carbide by Nanoindentation
Wear Mechanisms in Grinding of PCBN
Improving Tool Wear Resistance in Inconel 718 Cutting by Considering Surface Microstructures of CBN Cutting Tool
Effect of Carbide Orientation on Sliding Wear Behaviour of High Chromium Cast Iron
Enhanced Tribological Performance of CVD Diamond Films Enabled by Using Graphene Layers as Solid Lubricant
Chapter 9: In-Process Measurement and Monitoring, Metrology
Wide Range and Accurate Measurement of Wafer Thickness Gauge Using Optical Spectral Analyzer
Measurement of the Temperature Distribution at the Tool-Chip Interface by Using a Cutting Tool with Seven Pairs of Built-In Micro Cu/Ni Thermocouples
In-Process Monitoring of the Machining State in Superfinishing by Measuring the Dynamic Machining Forces
Experimental Study of the Causes for Shape Error of a Large Workpiece Machined by Surface Grinding
Measuring Method of Distribution of Abrasive Grain Cutting Edge by Means of AE Sensors
Investigation of End-Milling Process Based on Monitoring Method with Wireless Telegraphic Multifunctional Tool Holder and Infrared Thermography
The Use of Power Monitoring and Electron Microscopy in Evaluating the Performance and Fracture Characteristics of Abrasive Grains
Fabrication of Computer Generated Hologram for Aspheric Surface Measurement
Development of In-Process Monitoring System for Grinding Wheel Surface Temperature and Grinding State
Matching Algorithm for Profile Error Calculation of Blade Surface
Chapter 10: Machine Tools and Systems, Tooling Processing
Investigation of Control Methods of Chatter Vibration Based on Analysis of End-Milling Chatter Mark
Sensorless Cutting Force Estimation in Large Scale Ball-Screw-Driven Machine Tool
Optimization of Control Gains in Numerical Control
Loop Stiffness of Grinding Machine Developed for 450 mm Silicon Wafers
Development of Direct Drive Motor for Machine Tools and its Performance in Machining
New Development of Supersonic Surface Grinding Machine Tool with a Linear-Motor-Driven Table System
Improvement of Surface Roughness with Micro-Axial Vibration of Spindle by Pressure Pulsation of Grinding Fluid Supplied through inside of Wheel
Internally Cooled Toric Tools for Grinding of Medical Ceramics
Process Automation in Computer Controlled Polishing
by "Nielsen BookData"