Advances in hygrothermal performance of building envelopes : materials, systems and simulations

Author(s)

• Symposium on Advances in Hygrothermal Performance of Building Envelopes: Materials, Systems and Simulations
• Mukhopadhyaya, Phalguni
• Fisler, Diana
• ASTM Committee C-16 on Thermal Insulation
• ASTM Subcommittee C16.33 on Insulation Finishes and Moisture
• American Society for Testing and Materials

Bibliographic Information

Advances in hygrothermal performance of building envelopes : materials, systems and simulations

editors, Phalguni Mukhopadhyaya and Diana Fisler

（Selected technical papers, 1599）

ASTM International, c2017

Other Title

STP1599

Note

"Contains peer-reviewed papers that were presented at a symposium held October 26-27, 2016, in Orlando, Florida, USA. The workshop was sponsored by ASTM International Committee C16 on Thermal Insulation and Subcommittee C16.33 on Insulation Finishes and Moisture"--Foreword

"ASTM stock #STP1599"--T.p.

Includes bibliographical references

DOI: 10.1520/STP1599-EB

Details

• NCID: BB25425485
• ISBN:
  • 9780803176478
• LCCN: 2017024246
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: West Conshohocken, PA
• Pages/Volumes: viii, 394 p.
• Size: 23 cm
• Classification:
  • LCC : TH1719
  • DC23 : 690/.12
• Subject Headings:
  • LCSH : Buildings -- Airtightness -- Congresses
  • LCSH : Exterior walls -- Thermal properties -- Congresses
  • LCSH : Dampness in buildings -- Congresses
  • LCSH : Waterproofing -- Congresses
• Parent Bibliography ID:
  • BB16359266