Advances in hygrothermal performance of building envelopes : materials, systems and simulations

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書誌事項

Advances in hygrothermal performance of building envelopes : materials, systems and simulations

editors, Phalguni Mukhopadhyaya and Diana Fisler

(Selected technical papers, 1599)

ASTM International, c2017

タイトル別名

STP1599

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注記

"Contains peer-reviewed papers that were presented at a symposium held October 26-27, 2016, in Orlando, Florida, USA. The workshop was sponsored by ASTM International Committee C16 on Thermal Insulation and Subcommittee C16.33 on Insulation Finishes and Moisture"--Foreword

"ASTM stock #STP1599"--T.p.

Includes bibliographical references

DOI: 10.1520/STP1599-EB

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