Solder materials
著者
書誌事項
Solder materials
（WSPC Series in Advanced Integration and Packaging / Series editors, Avram Bar-Cohen, Shi-Wei Ricky Lee, v. 6）
World Scientific, c2018
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注記
Includes bibliographical references and index
内容説明・目次
内容説明
This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.
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