3rd Symposium on "Microjoining and Assembly Technology in Electronics", February 6-7, 1997, Yokohama

Author(s)

Bibliographic Information

3rd Symposium on "Microjoining and Assembly Technology in Electronics", February 6-7, 1997, Yokohama

溶接学会, 1997.2

Other Title

Mate '97

第3回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集

Proceedings of the 3rd Symposium on Microjoining and Assembly Technology in Electronics

Available at  / 1 libraries

Note

Sponsored by Japan Welding Society (Committee of Microjoining)

参考文献あり

抄録は英語

Details

  • NCID
    BB28834334
  • ISBN
    • 4906110347
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    280p
  • Size
    30cm
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