19th Symposium on "Microjoining and Assembly Technology in Electronics", January 29-30, 2013, Yokohama

Author(s)
Bibliographic Information

19th Symposium on "Microjoining and Assembly Technology in Electronics", January 29-30, 2013, Yokohama

溶接学会, 2013.1

Other Title

Mate 2013

第19回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.19, 2013

Proceedings of the 19th Symposium on Microjoining and Assembly Technology in Electronics, Vol.19, 2013

Note

Sponsored by Japan Welding Society (Committee of Microjoining)

参考文献あり

抄録は英語

Details
  • NCID
    BB28834651
  • ISBN
    • 9784906110223
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    492p
  • Size
    30cm
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