19th Symposium on "Microjoining and Assembly Technology in Electronics", January 29-30, 2013, Yokohama

Author(s)

Bibliographic Information

19th Symposium on "Microjoining and Assembly Technology in Electronics", January 29-30, 2013, Yokohama

溶接学会, 2013.1

Other Title

Mate 2013

第19回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.19, 2013

Proceedings of the 19th Symposium on Microjoining and Assembly Technology in Electronics, Vol.19, 2013

Available at  / 1 libraries

Note

Sponsored by Japan Welding Society (Committee of Microjoining)

参考文献あり

抄録は英語

Details

  • NCID
    BB28834651
  • ISBN
    • 9784906110223
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    492p
  • Size
    30cm
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