20th Symposium on "Microjoining and Assembly Technology in Electronics", February 4-5, 2014, Yokohama

Author(s)

Bibliographic Information

20th Symposium on "Microjoining and Assembly Technology in Electronics", February 4-5, 2014, Yokohama

溶接学会, 2014.2

Other Title

Mate 2014

第20回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.20, 2014

Proceedings of the 20th Symposium on Microjoining and Assembly Technology in Electronics, Vol.20, 2014

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Note

Sponsored by Japan Welding Society (Committee of Microjoining)

参考文献あり

抄録は英語

Details

  • NCID
    BB28834888
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    422p
  • Size
    30cm
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