21st Symposium on "Microjoining and Assembly Technology in Electronics", February 3-4, 2015, Yokohama

Author(s)

• Symposium on Microjoining and Assembly Technology in Electronics
• 溶接学会 ヨウセツ ガッカイ

Bibliographic Information

21st Symposium on "Microjoining and Assembly Technology in Electronics", February 3-4, 2015, Yokohama

溶接学会, 2015.2

Other Title

Mate 2015

第21回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.21, 2015

Proceedings of the 21st Symposium on Microjoining and Assembly Technology in Electronics, Vol.21, 2015

Note

Sponsored by Japan Welding Society (Committee of Microjoining)

参考文献あり

抄録は英語

• NCID: BB28834957
• Country Code: ja
• Title Language Code: eng
• Text Language Code: jpneng
• Place of Publication: 東京
• Pages/Volumes: 446p
• Size: 30cm