25th Symposium on "Microjoining and Assembly Technology in Electronics", January 29-30, 2019, Yokohama

Author(s)

Bibliographic Information

25th Symposium on "Microjoining and Assembly Technology in Electronics", January 29-30, 2019, Yokohama

溶接学会, 2019.1

Other Title

Mate 2019

第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.25, 2019

Proceedings of the 25th Symposium on Microjoining and Assembly Technology in Electronics, Vol.25, 2019

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Note

Sponsored by Committee on Manufacturing Science and Technology in Electronics (SPS), Microjoining Commission (JWS)

参考文献あり

抄録は英語

Details

  • NCID
    BB28874973
  • Country Code
    ja
  • Title Language Code
    eng
  • Text Language Code
    jpneng
  • Place of Publication
    東京
  • Pages/Volumes
    418p
  • Size
    30cm
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