Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January, 2007, San Jose, California, USA
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Bibliographic Information
Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January, 2007, San Jose, California, USA
（Proceedings / SPIE -- the International Society for Optical Engineering, v. 6463）
SPIE, c2007
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Reliability, packaging, testing, and characterization of MEMS/MOEMS 6
Reliability, packaging, testing, and characterization of MEMS/MOEMS six
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Includes bibliographical references and author index
Description and Table of Contents
Description
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
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