Photonics packaging, integration, and interconnects VII : 23-25 January 2007, San Jose, California, USA

Author(s)

• Photonics Packaging, Integration, and Interconnects
• Earman, Allen M.
• Chen, Ray T.
• Society of Photo-optical Instrumentation Engineers

Bibliographic Information

Photonics packaging, integration, and interconnects VII : 23-25 January 2007, San Jose, California, USA

Allen M. Earman, Ray T. Chen, editors ; sponsored and published by SPIE--the International Society for Optical Engineering

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 6478）

SPIE, c2007

Other Title

Photonics packaging, integration, and interconnects 7

Photonics packaging, integration, and interconnects seven

Note

Includes bibliographical references and author index

Details

• NCID: BB30888438
• ISBN:
  • 9780819465917
• LCCN: 2007295465
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Bellingham, Wash.
• Pages/Volumes: 1 v. (various pagings)
• Size: 28 cm
• Classification:
  • LCC : TK8300
  • DC22 : 621.36
• Subject Headings:
  • LCSH : Optoelectronic devices -- Design and construction -- Congresses
  • LCSH : Optical interconnects -- Congresses
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Photonics -- Congresses
• Parent Bibliography ID:
  • BA0022700X