Micromachined devices and components IV : 21-22 September, 1998, Santa Clara, California

著者

• French, Patrick J.
• Chau, Kevin
• Society of Photo-optical Instrumentation Engineers
• Semiconductor Equipment and Materials International

書誌事項

Micromachined devices and components IV : 21-22 September, 1998, Santa Clara, California

Patrick J. French, Kevin Chau, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperaing organizations , SEMI--Semiconductor Equipment and Materials International ... [et al.]

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 3514）

SPIE, c1998

タイトル別名

Micromachined devices and components 4

Micromachined devices and components four

注記

Includes bibliographical references and author index

内容説明・目次

内容説明

An assessment of micromachined devices and components. It contains discussion of bonding and packaging, including wafer bonding with an adhesive coating, and examination of chemical and gas sensors, including acoustic-wave chemical microsensors in GaAs.

「Nielsen BookData」 より

• NII書誌ID(NCID): BC07260267
• ISBN:
  • 0819429732
• LCCN: 98226766
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Bellingham, Washington
• ページ数/冊数: viii, 440 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TJ163
  • DC21 : 620/.5
• 件名:
  • LCSH : Electromechanical devices -- Congresses
  • LCSH : Micromechanics -- Congresses
  • LCSH : Micromachining -- Congresses
• 親書誌ID:
  • BA0022700X