Microelectronic yield, reliability, and advanced packaging : 28-30 November 2000, Singapore

Author(s)

• Tan, Cher Ming
• Society of Photo-optical Instrumentation Engineers
• Nanyang Technological University
• Institute of Physics, Singapore

Bibliographic Information

Microelectronic yield, reliability, and advanced packaging : 28-30 November 2000, Singapore

Cher Ming Tan ... [et al.], chairs/editors ; sponsored by Nanyang Technological University (Singapore) [and] SPIE--the International Society for Optical Engineering ; cooperating organizations, Institute of Physics (Singapore) ... [et al.]

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 4229）

SPIE, c2000

Note

Includes bibliographical references and index

Details

• NCID: BC0747336X
• ISBN:
  • 0819439010
• LCCN: 2001277635
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Bellingham, Wash., USA
• Pages/Volumes: xvii, 222 p.
• Size: 28 cm
• Classification:
  • LCC : TK7875
  • DC21 : 621.381
• Subject Headings:
  • LCSH : Microelectromechanical systems -- Reliability -- Congresses
  • LCSH : Microelectronic packaging -- Congresses
• Parent Bibliography ID:
  • BA0022700X