Photonics packaging and integration V : 27 January, 2005, San Jose, California, USA

Author(s)

• Heyler, Randy A.
• Chen, Ray T.
• Society of Photo-optical Instrumentation Engineers

Bibliographic Information

Photonics packaging and integration V : 27 January, 2005, San Jose, California, USA

Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 5731）

SPIE, c2005

• pbk.

Other Title

Photonics packaging and integration 5

Optoelectronic interconnects. Photonics packaging and integration

Note

Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration

Includes bibliographical references and author index

Description and Table of Contents

Description

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

by "Nielsen BookData"

Details

• NCID: BC07803238
• ISBN:
  • 0819457051
• LCCN: 2007275930
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Bellingham, Wash.
• Pages/Volumes: v, 136 p.
• Size: 28 cm
• Classification:
  • LCC : TA1750
  • DC22 : 621.36
• Subject Headings:
  • LCSH : Optoelectronic devices -- Design and construction -- Congresses
  • LCSH : Optical interconnects -- Congresses
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Photonics -- Congresses
• Parent Bibliography ID:
  • BA0022700X