Photonics packaging and integration VI : 25-26 January, 2006, San Jose, California, USA

Author(s)

• Earman, Allen M.
• Chen, Ray T.
• Society of Photo-optical Instrumentation Engineers

Bibliographic Information

Photonics packaging and integration VI : 25-26 January, 2006, San Jose, California, USA

Allen M. Earman, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 6126）

SPIE, c2006

Other Title

Photonics packaging and integration 6

Optoelectronic interconnects. Photonics packaging and integration

Note

Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration

Includes bibliographical references and author index

Details

• NCID: BC07803282
• ISBN:
  • 0819461687
• LCCN: 2006281946
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Bellingham, Wash.
• Pages/Volumes: 1 v. (various pagings)
• Size: 28 cm
• Classification:
  • LCC : TK7874
  • DC22 : 621.36
• Subject Headings:
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Optoelectronic devices -- Design and construction -- Congresses
  • LCSH : Optical interconnects -- Congresses
  • LCSH : Photonics -- Congresses
• Parent Bibliography ID:
  • BA0022700X