Photonics packaging and integration VI : 25-26 January, 2006, San Jose, California, USA

著者

• Earman, Allen M.
• Chen, Ray T.
• Society of Photo-optical Instrumentation Engineers

書誌事項

Photonics packaging and integration VI : 25-26 January, 2006, San Jose, California, USA

Allen M. Earman, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 6126）

SPIE, c2006

タイトル別名

Photonics packaging and integration 6

Optoelectronic interconnects. Photonics packaging and integration

注記

Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration

Includes bibliographical references and author index

内容説明・目次

内容説明

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BC07803282
• ISBN:
  • 0819461687
• LCCN: 2006281946
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Bellingham, Wash.
• ページ数/冊数: 1 v. (various pagings)
• 大きさ: 28 cm
• 分類:
  • LCC : TK7874
  • DC22 : 621.36
• 件名:
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Optoelectronic devices -- Design and construction -- Congresses
  • LCSH : Optical interconnects -- Congresses
  • LCSH : Photonics -- Congresses
• 親書誌ID:
  • BA0022700X