Advances in chemical mechanical planarization (CMP)

Author(s)

• Babu, Suryadevara

Bibliographic Information

Advances in chemical mechanical planarization (CMP)

Edited by Suryadevara Babu

（Woodhead Publishing series in electronic and optical materials）

Woodhead Pub. is an imprint of Elsevier, c2022

2nd ed

Note

Includes bibliographical references and index

Details

• NCID: BC11630144
• ISBN:
  • 9780128217917
• LCCN: 2022301333
• Country Code: uk
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Duxford
• Pages/Volumes: xiii, 632 p.
• Size: 23 cm
• Classification:
  • DC23 : 621.38152
  • LCC : TK7874.84
• Subject Headings:
  • LCSH : Chemical mechanical planarization
  • LCSH : Semiconductors -- Materials
• Parent Bibliography ID:
  • BB10852471