Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24-25 January 2005, San Jose, California, USA

Bibliographic Information

Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24-25 January 2005, San Jose, California, USA

Danelle M. Tanner, Rajeshuni Ramesham, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering ; cooperating organizations, SEMI--Semiconductor Equipment and materials International, Solid State Technology [and] Sandia National Laboratories (USA)

(Proceedings / SPIE -- the International Society for Optical Engineering, v. 5716)

SPIE, c2005

Other Title

Reliability, testing and characterization of MEMS/MOEMS

Reliability, packaging, testing, and characterization of MEMS, MOEMS 4

Available at  / 1 libraries

Search this Book/Journal

Note

Previous conferences entitled: Reliability, testing, and characterization of MEMS/MOEMS

Includes bibliographical references and author index

Related Books: 1-1 of 1

  • Proceedings

    SPIE -- the International Society for Optical Engineering

    SPIE -- the International Society for Optical Engineering

Details

Page Top