Handbook of thin film deposition
著者
書誌事項
Handbook of thin film deposition
William Andrew, an imprint of Elsevier , [Amazon], c2018
4th ed
- : pbk
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注記
Reprint. Originally published: Oxford ; Cambridge, Mass. : William Andrew, an imprint of Elsevier, c2018
"Printed in Japan. 落丁、乱丁本のお問い合わせは Amazon.co.jp カスタマーサービスへ"--Last page (p. [450])
Includes bibliographical references and index
内容説明・目次
内容説明
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability.
目次
Section 1 - SCALING 1. A Perspective on Today's Scaling Challenges and Possible Future Direction 2. Limits and Hurdles To Continued Cmos Scaling 3. Reliability Issues: Reliability Imposed Limits to Scaling 4. Thermal Engineering at the Limits of the CMOS Era
Section 2 - THIN FILM DEPOSITION EQUIPMENT AND PROCESSING 5. Limits Of Gate Dielectrics Scaling 6. Process Technology for Copper Interconnects 7. Sputter Processing 8. Thin Film Deposition for Front End of Line: The Effect of the Semiconductor Scaling, Strain Engineering and Pattern Effects 9. Equipment in CVD Processing 10. CMP Method and Practice 11. Atomic Layer Deposition: Fundamentals, Practice and Challenges 12. Optical Thin Films 13. Semiconductor Memory
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