Chiplet design and heterogeneous integration packaging

著者

• Lau, John H.

書誌事項

Chiplet design and heterogeneous integration packaging

John H. Lau

Springer Nature Singapore, c2023

注記

Includes bibliographical references and index

内容説明・目次

内容説明

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

目次

State-of-the-Art of Advanced Packaging.- Chip Partition and Chip Split.- Multiple System and Heterogeneous Integration with TSV Interposers.- Multiple System and Heterogeneous Integration with TSV-Less Interposers.- Chiplets Lateral (Horizontal) Communications.- Cu-Cu Hybrid Bonding.

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BD00591365
• ISBN:
  • 9789811999161
• 出版国コード: si
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Singapore
• ページ数/冊数: xxii, 525 p.
• 大きさ: 25 cm
• 分類:
  • DC23 : 621.3815
• 件名:
  • LCSH : Integrated circuits -- Design and construction
  • LCSH : Microelectronic packaging