3D IC integration and packaging

Author(s)

• Lau, John H.

Bibliographic Information

3D IC integration and packaging

John H. Lau

McGraw-Hill Education, c2016

Note

Includes bibliographical references and index

Details

• NCID: BD02071300
• ISBN:
  • 9780071848060
• LCCN: 2015013446
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: xxii, 458 p.
• Size: 25 cm
• Classification:
  • LCC : TK7874.893
  • DC23 : 621.3815
• Subject Headings:
  • LCSH : Three-dimensional integrated circuits
  • LCSH : Microelectronic packaging