Lead-free soldering process development and reliability

Author(s)

• Bath, Jasbir

Bibliographic Information

Lead-free soldering process development and reliability

edited by Jasbir Bath

（Wiley series in quality and reliability engineering）

Wiley, 2020

• : hardback

Note

Includes bibliographical references and index

Details

• NCID: BD03972605
• ISBN:
  • 9781119482031
• LCCN: 2020004969
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: Hoboken, N.J.
• Pages/Volumes: xxii, 481 p.
• Size: 24 cm
• Classification:
  • LCC : TK7870.15
  • DC23 : 621.381/046
  • DC23 : 621.381046
• Subject Headings:
  • LCSH : Electronic packaging
  • LCSH : Solder and soldering
• Parent Bibliography ID:
  • BA27800930