6th ACM International Workshop on Data Engineering for Wireless and Mobile Access : MobiDE '07 : June 10, 2007, Beijing, China

書誌事項

6th ACM International Workshop on Data Engineering for Wireless and Mobile Access : MobiDE '07 : June 10, 2007, Beijing, China

[sponsored by ACM SIGMOD ; supported by SIGMOBILE, HP, Microsoft Reserach]

Association for Computing Machinery , Printed from e-media with permission by Curran Associates, c2007

タイトル別名

MobiDE 2007

Proceedings of the sixth ACM International Workshop on Data Engineering for Wireless and Mobile Access, June 10, 2007, Beijing, China

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注記

"ACM Order Number 617073"--t p. verso

詳細情報

  • NII書誌ID(NCID)
    BD09137597
  • ISBN
    • 9781604231595
  • 出版国コード
    us
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    New York, NY,Red Hook, NY
  • ページ数/冊数
    82 pages
  • 大きさ
    28 cm
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