{"@context":{"owl":"http://www.w3.org/2002/07/owl#","bibo":"http://purl.org/ontology/bibo/","foaf":"http://xmlns.com/foaf/0.1/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/"},"@id":"https://ci.nii.ac.jp/ncid/BD10642815.json","@graph":[{"@id":"https://ci.nii.ac.jp/ncid/BD10642815#entity","@type":"bibo:Book","foaf:isPrimaryTopicOf":{"@id":"https://ci.nii.ac.jp/ncid/BD10642815.json"},"dc:title":[{"@value":"次世代高速・高周波伝送部材の開発動向"},{"@value":"ジセダイ コウソク・コウシュウハ デンソウ ブザイ ノ カイハツ ドウコウ","@language":"ja-hrkt"}],"dcterms:alternative":["次世代高速高周波伝送部材の開発動向"],"dc:creator":"技術情報協会企画編集","dc:publisher":[{"@value":"技術情報協会"}],"dcterms:extent":"600p","cinii:size":"31cm","dc:language":"jpn","dc:date":"2024","cinii:ncid":"BD10642815","cinii:ownerCount":"1","foaf:maker":[{"@id":"https://ci.nii.ac.jp/author/DA11384968#entity","@type":"foaf:Person","foaf:name":[{"@value":"技術情報協会"},{"@value":"ギジュツ ジョウホウ キョウカイ","@language":"ja-hrkt"}]}],"bibo:owner":[{"@id":"https://ci.nii.ac.jp/library/FA007670","@type":"foaf:Organization","foaf:name":"同志社大学 図書館","rdfs:seeAlso":{"@id":"https://doors.doshisha.ac.jp/opac/opac_openurl/?ncid=BD10642815"}}],"prism:publicationDate":["2024.12"],"cinii:note":["表現種別: テキスト (ncrcontent), 機器種別: 機器不用 (ncrmedia), キャリア種別: 冊子 (ncrcarrier)","執筆: 田中顕裕ほか","文献あり","背に「2274」とあり"],"dc:subject":["NDLC:ND541","NDC10:547.3"],"foaf:topic":[{"@id":"https://ci.nii.ac.jp/books/search?q=%E9%80%9A%E4%BF%A1%E9%83%A8%E5%93%81","dc:title":"通信部品"},{"@id":"https://ci.nii.ac.jp/books/search?q=%E7%A7%BB%E5%8B%95%E9%80%9A%E4%BF%A1","dc:title":"移動通信"}],"dcterms:hasPart":[{"@id":"urn:isbn:9784867980545"}]}]}