{"@context":{"owl":"http://www.w3.org/2002/07/owl#","bibo":"http://purl.org/ontology/bibo/","foaf":"http://xmlns.com/foaf/0.1/","rdfs":"http://www.w3.org/2000/01/rdf-schema#","prism":"http://prismstandard.org/namespaces/basic/2.0/","cinii":"http://ci.nii.ac.jp/ns/1.0/","dc":"http://purl.org/dc/elements/1.1/","dcterms":"http://purl.org/dc/terms/"},"@id":"https://ci.nii.ac.jp/ncid/BD18558370.json","@graph":[{"@id":"https://ci.nii.ac.jp/ncid/BD18558370#entity","@type":"bibo:Book","foaf:isPrimaryTopicOf":{"@id":"https://ci.nii.ac.jp/ncid/BD18558370.json"},"dc:title":[{"@value":"半導体実装技術の基礎と応用 : 高集積化・高機能化を実現するマイクロ接合・評価・解析"},{"@value":"ハンドウタイ ジッソウ ギジュツ ノ キソ ト オウヨウ : コウシュウセキカ・コウキノウカ オ ジツゲン スル マイクロ セツゴウ・ヒョウカ・カイセキ","@language":"ja-hrkt"}],"dcterms:alternative":["半導体実装技術の基礎と応用 : 高集積化高機能化を実現するマイクロ接合評価解析"],"dc:creator":"[著]巽宏平","dc:publisher":[{"@value":"科学情報出版"}],"dcterms:extent":"IX, 302p, 図版14p (ページ付なし)","cinii:size":"21cm","dc:language":"jpn","dc:date":"2026","cinii:ncid":"BD18558370","cinii:ownerCount":"1","foaf:maker":[{"@id":"https://ci.nii.ac.jp/author/DB0057861X#entity","@type":"foaf:Person","foaf:name":[{"@value":"巽, 宏平"},{"@value":"タツミ, コウヘイ","@language":"ja-hrkt"}]}],"bibo:owner":[{"@id":"https://ci.nii.ac.jp/library/FA001109","@type":"foaf:Organization","foaf:name":"北海道大学 大学院工学研究科・工学部図書室","rdfs:seeAlso":{"@id":"https://opac.lib.hokudai.ac.jp/opac/opac_openurl/?ncid=BD18558370"}}],"prism:publicationDate":["2026.4"],"cinii:note":["表現種別: テキスト (ncrcontent), 機器種別: 機器不用 (ncrmedia), キャリア種別: 冊子 (ncrcarrier)","参考文献: 各章末"],"dc:subject":["NDC10:549.8","NDLC:ND371","NDC9:549.8"],"foaf:topic":[{"@id":"https://ci.nii.ac.jp/books/search?q=%E5%8D%8A%E5%B0%8E%E4%BD%93","dc:title":"半導体"},{"@id":"https://ci.nii.ac.jp/books/search?q=%E5%8D%8A%E5%B0%8E%E4%BD%93","dc:title":"半導体"}],"dcterms:isPartOf":[{"@id":"https://ci.nii.ac.jp/ncid/BB11373521#entity","dc:title":"設計技術シリーズ","@type":"bibo:Book"}],"dcterms:hasPart":[{"@id":"urn:isbn:9784910558554"}]}]}