本田 将之 HONDA Masayuki

ID:9000002961845

茨城大学理工学研究科 (2002年 CiNii収録論文より)

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Articles:  1-5 of 5

  • Research on Chemo-Mechanical-Grinding(CMG) of Si wafer : 1^<st> Report : Development of CMG Wheel  [in Japanese]

    ZHOU Libo , KAWAI Shinji , HONDA Masayuki , SHIMIZU Jun , EDA Hiroshi , YAKITA Kazuaki

    At ductile-mode grinding, the material is removed within a plastic region so that no crack remains on the corresponding surface after machining. By effectively using this mechanism, fixed abrasive pro …

    Journal of the Japan Society for Precision Engineering 68(12), 1559-1563, 2002-12-05

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  • Evaluation Method for Grinding Damage in Si Wafer using X-Ray Diffraction  [in Japanese]

    HONDA Masayuki , ZHOU Libo , SHIMIZU Jun , EDA Hiroshi , OHTA Hiroyuki

    High integration of semiconductor devices requires not only a very good surface integrity in terms of surface, flatness and etc., but also damage free at subsurface of the machined silicon wafers. Lit …

    The proceedings of the JSME annual meeting 2002.5(0), 299-300, 2002

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  • Siウエハの研削加工ダメージの評価に関する研究  [in Japanese]

    本田 将之 , 周 立波 , 清水 淳 , 江田 弘 , 太田 裕之

    精密工学会大会学術講演会講演論文集 2001(2), 435, 2001-09-01

    References (4)

  • 413 Physical-property evaluation of ground Si wafer surfaces  [in Japanese]

    KOBAYASHI Miho , HONDA Masayuki , MOMOSE Yoshihiro , Zhou LIBO , EDA Hiroshi

    The characteristics of ground Si surfaces have been investigated by TPPE (Temperature Programmed Photoelectron Emission) in order to analyze the mechanism of machining single crystalline silicon. Si-w …

    The Proceedings of Ibaraki District Conference 2001(0), 101-102, 2001

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  • 804 Ultraprecision Grinding of φ300mm Si Wafer  [in Japanese]

    HONDA Masayuki , EDA Hiroshi , ZHOU Libo , SHIMIZU Jun , LI Jyujin , SHINOHARA Kazuhiro , KOBAYASHI Miho

    The objective of this study is zero-defect machining for φ300 silicon wafer by newly developed one-stop grinding machine. The one-stop grinding machine is designed to replace the conventional lapping, …

    The Proceedings of Ibaraki District Conference 2000(0), 217-218, 2000

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