君塚 亮一 KIMIZUKA Ryoichi

ID:9000004969685

荏原ユージライト(株)中央研究所 R & D Headquarters Ebara-Udylite Co., Ltd. (2001年 CiNii収録論文より)

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Articles:  1-2 of 2

  • Two-step Copper Electroplating Technique using Seed Enhancement step  [in Japanese]

    HOSOI Nobuki , KIMIZUKA Ryoichi , NAGAI Mizuki , OKUYAMA Shuichi , KOBAYASHI Takeshi , ITO Nobukazu , ARITA Koji , MIYAMOTO Hidenobu

    We have developed the two-step copper (Cu) electroplating (EP) technique using alkali-metal-free copper pyrophosphate bath for Cu seed enhancement EP step. Alkali-metal-free copper pyrophosphate bath …

    Technical report of IEICE. SDM 101(430), 7-11, 2001-11-09

    References (2)

  • Acid Copper Plating Technology for Electronics (Electro Device) Field  [in Japanese]

    HAGIWARA Hideki , KOBAYASHI Takeshi , KIMIZUKA Ryoichi

    Journal of The Surface Finishing Society of Japan 52(1), 50-51, 2001-01-01

    J-STAGE  References (3) Cited by (1)

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