北村 佳子 KITAMURA Keiko

ID:9000006848383

株式会社きもと Kimoto Co., Ltd. (2008年 CiNii収録論文より)

Search authors sharing the same name

Articles:  1-1 of 1

  • Good Adhesive Copper Wiring Formation Technology on PET Film  [in Japanese]

    MATSUI Kiichi , WATANABE Mitsuhiro , SUGIMOTO Masaharu , KITAMURA Keiko , OTA Tetsuji , HONMA Hideo

    In recent years, as electronic devices have become smaller and multi-functionalized, printed wiring boards (PWBs) have required correspondingly higher density and more integration. Generally, organic …

    Journal of Japan Institute of Electronics Packaging 11(7), 540-543, 2008-11-01

    References (3) Cited by (1)

Page Top