Sasaki Sho SASAKI Sho

ID:9000017325983

OMRON Corporation (2010年 CiNii収録論文より)

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  • Realization of MEMS-IC Vertical Integration Utilizing Smart Bumpless Bonding

    SHIOZAKI Masayoshi , MORIGUCHI Makoto , SASAKI Sho , OBA Masatoshi

    This paper reports fundamental technologies, properties, and new experimental results of SBB (Smart Bumpless Bonding) to realize MEMS-IC vertical integration. Although conventional bonding technologie …

    IEEJ Transactions on Sensors and Micromachines 130(5), 152-156, 2010-05-01

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