石井 大輔 ISHII Daisuke

ID:9000018745656

慶應義塾大学大学院 Department of Mechanical Engineering, Keio University (2010年 CiNii収録論文より)

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  • PS50 Evaluation of interfacial strength with cutting principle  [in Japanese]

    ISHII Daisuke , OMIYA Masaki , HOSHINO Hiroaki

    The purpose of this paper is to develop the evaluation method of interfacial strengths with a micro cutting system. The interfacial strength of thin films is crucial for the reliability assessment of …

    The Proceedings of the Materials and Mechanics Conference 2010(0), 157-159, 2010

    J-STAGE

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