河合 末男 KAWAI Sueo

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  • Thermal fatigue strength estimation of solder joints of surface mount IC packages.  [in Japanese]

    KITANO Makoto , KAWAI Sueo , SHIMIZU Ichio

    Long-term reliability against thermal fatigue is required for solder joints of surface mount IC packages. This study was carried out in order to estimate thermal fatigue strength of the solder joints …

    TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 54(505), 1709-1715, 1988

    J-STAGE  Cited by (9)

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