河合 末男 KAWAI Sueo

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  • Residual stress in resin-molded IC chips.  [in Japanese]

    MIURA Hideo , NISHIMURA Asao , KAWAI Sueo , NISHI Kunihiko

    Residual stress in IC silicon chips molded using epoxy resin is discussed. Stress-sensing chips were used for the measurement of residual stress which developed during assembly processes for IC plasti …

    TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 55(516), 1763-1770, 1989

    J-STAGE  Cited by (4)

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