河合 末男 KAWAI Sueo

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  • Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages.  [in Japanese]

    MIURA Hideo , NISHIMURA Asao , KAWAI Sueo , NISHI Kunihiko

    Thermal stress in silicon chips encapsulated in IC plastic packages was discussed using stress-sensing chips which the authors developed utilizing the piezoresistive effect of silicon. Sensor chips we …

    TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 57(539), 1575-1580, 1991

    J-STAGE  Cited by (1)

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