河合 末男 KAWAI Sueo

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  • A study of package cracking during the reflow soldering process.  [in Japanese]

    KITANO Makoto , KAWAI Sueo , NISHIMURA Asao , NISHI Kunihiko

    Recently, the plastic packages of ICs have been changing from insertion types to surface mounted types. Reflow soldering is used for surface mounted ICs onto printed circuit boards. During the process …

    TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 55(510), 356-363, 1989

    J-STAGE  Cited by (6)

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