木伏 理沙子 KIBUSHI Risako

Articles:  1-3 of 3

  • Thermal Design of PCB Using CFD Analysis with Effective Thermal Conductivity  [in Japanese]

    HATAKEYAMA Tomoyuki , KIBUSHI Risako , ISHIZUKA Masaru

    近年,電子機器の小形化・高性能化に伴う実装の高密度化により,機器内部の発熱密度が増大し,電子機器の最適な熱設計が重要性を増している.特に,電子部品はプリント配線基板(PCB)上に配置されるため,PCBの温度分布予測は非常に重要となっている.PCBの温度分布予測は通常,数値流体力学(CFD)解析によって行われることが多い.しかし,PCBの複雑な配線を詳細に考慮したモデルでの計算は,膨大な計算時間を要 …

    The transactions of the Institute of Electronics, Information and Communication Engineers. C 95(11), 427-433, 2012-11-01

    References (17)

  • H131 Evaluation of Heat Generation of Si Power MOSFET using Electro-Thermal Analysis  [in Japanese]

    Kibushi Risako , Hatakeyama Tomoyuki , Ishizuka Masaru

    This paper describes thermal and electrical properties of Si power MOSFET. The problem of hot spot in submicron scla Si MOSFET has been widely known. Recently, Si power MOSFET is key device in a lot o …

    The Proceedings of the Thermal Engineering Conference 2012(0), 245-246, 2012

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  • D121 Analysis of Temperature Distribution on Circuit Board in Laser Soldering  [in Japanese]

    Kibushi Risako , Ishiduka Masaru , Hatakeyama Tomoyuki

    This study describes temperature difference reduction among solder balls when solder balls are heated up with a uniform laser beam at a time by using CFD analysis. We focus on flexible printed wiring …

    The Proceedings of the Thermal Engineering Conference 2011(0), 81-82, 2011

    J-STAGE 

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