CHIN Frank Y.-J.


Electrical and Computer Engineering Department, University of California (1997年 CiNii収録論文より)

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  • Low Temperature Direct Silicon Wafer Bonding Using Argon Activation

    BOWER Robert W. , CHIN Frank Y.-J.

    We have observed that silicon surfaces activated in an Ar plasma form very strong bonds after a low temperature anneal. However, voids formed by Ar gas bubbles develop during the annealing process. Th …

    Japanese Journal of Applied Physics 36(5), L527-L528, 1997-05-01

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