渡辺 潔
,
志田 朝彦
,
森成 良佐
,
皆川 貞利
,
佐々木 秀昭
,
和井 伸一
Parallel gap resistance welding of Ag plated 0.18 mm diameter oxygen free copper wires to three types of patterns (solder plated, Au plated, Au+Ni plated) of printed circuit boards (P/B) was investiga …
J-STAGE