藤本 公三 , 三井津 健 , 澤田 裕美子 , 仲田 周次

TAB (Tape Automated Bonding) technology is the main method in IC interconnection technology, because it can be applied to fine pitch, under 100 μm pitch. In the conventional TAB technology which is th …

溶接学会論文集 14(1), 179-183, 1996

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