今戸 啓二 IMADO Keiji

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  • A Study of Fixing Force for a Work Utilized Vacuume in Ultrasonic Wire Bonders.  [in Japanese]

    IMADO Keiji , OHTA Yuzo , MIURA Atuyoshi , MIYAGAWA Hiroomi , MIYAGAKI Tetsuya , HATASAKO Manabu

    In an assembling process of semiconductor devices, many kinds of ultrasonic wire bonders are generally used. In these machines, works are usually placed on a plate with small vacuum suction hole(s) to …

    TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C 66(649), 3181-3187, 2000

    J-STAGE 

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