西野 有 Nishino Tamotsu

ID:9000258390897

三菱電機 Mitsubishi Electric Corp. (2005年 CiNii収録論文より)

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  • Through Wafer Vias for RF Interconnection by Molten Solder Ejection Method

    Fujii Yoshio , Yokoyama Yoshinori , Yoshida Yukihisa , Fukumoto Hiroshi , Takeda Munehisa , Nishino Tamotsu

    Through wafer vias plugged with solder for RF interconnection are described. Molten solder ejection method is a maskless full-dry process and it was shown that the plugging solder was voidless and her …

    Proceedings of JIEP Annual Meeting 19(0), 113-114, 2005

    J-STAGE 

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