Matsumoto Takuji, Satoh Masakazu, Sakuma Katsuyuki, Kurino Hiroyuki, Miyakawa Nobuaki, Itani Hikotaro, Koyanagi Mitsumasa
Japanese Journal of Applied Physics
37
(3B),
1217-1221,
1998
...A new three-dimensional (3D) wafer bonding technology using the adhesive injection method has been proposed, in order to realize a real-time micro-vision system and a real shared memory....
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