International Symposium on Advances in Interconnection and Packaging

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  • Microelectronic interconnects and packages, optical and electrical technologies

    Gnanalingam Arjavalingam, James Pazaris, conference chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organizations, Components, Hybrids, and Manufacturing Technology Society of the IEEE, Computer Society of the IEEE

    SPIE c1991 Proceedings / SPIE -- the International Society for Optical Engineering v. 1389 . International Symposium on Advances in Interconnection and Packaging / Alfred P. DeFonzo, symposium chair/general editor ; bk. 1

    Available at 2 libraries

  • Microelectronic interconnects and packages, system and process integration

    Stuart K. Tewksbury, John R. Carruthers, conference chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering, cooperating organizations, Components, Hybrids, and Manufacturing Technology Society of the IEEE, Computer Society of the IEEE

    SPIE c1991 Proceedings / SPIE -- the International Society for Optical Engineering v. 1390 . International Symposium on Advances in Interconnection and Packaging / Alfred P. DeFonzo, symposium chair/general editor ; bk. 2

    Available at 2 libraries

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