Microelectronic interconnects and packages, system and process integration

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Microelectronic interconnects and packages, system and process integration

Stuart K. Tewksbury, John R. Carruthers, conference chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering, cooperating organizations, Components, Hybrids, and Manufacturing Technology Society of the IEEE, Computer Society of the IEEE

（Proceedings / SPIE -- the International Society for Optical Engineering, v. 1390 . International Symposium on Advances in Interconnection and Packaging / Alfred P. DeFonzo, symposium chair/general editor ; bk. 2）

SPIE, c1991

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Papers from the International Symposium on Advances in Interconnection and Packaging, held 5-9 Nov. 1990, Boston, Mass.

Includes bibliographical references and index

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  • Proceedings

    SPIE -- the International Society for Optical Engineering

    SPIE -- the International Society for Optical Engineering

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